Interactive Field Effect of Atomic Bonding Forces on the Equivalent Elastic Modulus Estimation of Micro-Level Single-Crystal Copper by Utilizing Atomistic-Continuum Finite Element Simulation

Interactive Field Effect of Atomic Bonding Forces on the Equivalent Elastic Modulus Estimation of Micro-Level Single-Crystal Copper by Utilizing Atomistic-Continuum Finite Element Simulation

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This study uses the finite element analysis (FEA)-based atomistic-continuum method (ACM) combined with the Morse potential of metals to determine the effects of the elastic modulus (E) of a given example on atomic-level single-crystal copper (Cu).This work aims to overcome the estimated drawback of a molecular dynamic calculation applied to the mechanical response Whiskey Decanter Set of macro in-plane-sized and atomic-level-thick metal-based surface coatings.The interactive energy of two Cu atoms within a face-centered metal lattice was described by a mechanical response of spring stiffness.Compared with the theoretical value, the parameters of the Morse potential dominated the predicted Vacuum Dust Container accuracy through the FEA-based ACM.

Moreover, the analytic results indicated that the effective E of a single-crystal Cu was significantly sensitive to the given range of the interactive force field among atoms.The reliable elastic moduli of 86.8, 152.6, and 205.

2 GPa along the Cu(100), Cu(110), and Cu(111) orientations of the Cu metal were separately acquired using the presented FEA-based ACM methodology.